10G SFP+ BIDI LR Transceiver for 10km SMF Links, 1270/1330nm Simplex LC

SFP+BD-10-1213-10(LR)-LC

  • Broad Multi-Brand Compatibility
  • Flexible Customization Support
  • Tested for Reliable Performance
  • Fast Response & Delivery
  • Professional Technical Support

The FC-LINK SFP+ BIDI 10G 1270/1330nm 10km LR LC SX single-mode transceiver is a compact, pluggable module tailored for duplex optical data communication, including IEEE 802.3ae 10GBASE-LR/LW applications. Featuring an SFP+ 20-pin connector, it supports hot-plug capability. Designed for single-mode fiber, this module operates at a nominal wavelength of either 1270nm or 1330nm. The transmitter section employs a multiple quantum well DFB laser, compliant with Class 1 laser safety standards under IEC-60825. The receiver integrates an InGaAs detector preamplifier (IDP) within an optical header, alongside a limiting post-amplifier IC for efficient and reliable signal processing.

SPECIFICATIONS
Product ModelSFP+BD-10-1213-10(LR)-LCManufacturer BrandFC-LINK
Package TypeSFP+ BIDIOptical ConnectorDuplex LC
Max Data Rate11.3GbpsChannel Data Rate10.3125Gbps
Effective Transmission Distance10km
WavelengthTx:1270nm/Rx:1330nm
Tx:1330nm/Rx:1270nm
Operating Voltage3.3V
Fiber TypeSMFCore Size9/125µm
Transmitter TypeDFBReceiver TypeIDP
TX Power-5~0dBmReceiver Sensitivity-14dBm
Digital Diagnostic Monitoring(DDM)YESReceiver Overload0.5dBm
Power Consumption<1.5WProtocolsSFF-8431
IEEE 802.3ae 10GBASE-LR
IEEE 802.3ae 10GBASE-LW
SFF-8472
Operating Temperature(Commercial)0℃~+70℃Storage Temperature(Commercial)-40℃~+85℃
Operating Temperature(Industrial)-40℃~+85℃Storage Temperature(Industrial)-40℃~+85℃
Server-to-Switch Data Center Links

Used for 10G/25G/100G optical uplinks between servers and top-of-rack switches in high-density data center deployments.

Building-to-Building Campus Backbone

Suitable for 1G/10G fiber links between office buildings, campus distribution rooms, and backbone aggregation points.

Access-to-Core Enterprise Uplinks

Designed for switch uplinks from access to aggregation or core layers in enterprise and campus network architectures.

Industrial Switching in Harsh Environments

Applied in industrial Ethernet, automation systems, and outdoor cabinets where wider temperature tolerance and stable fiber communication are required.


网络拓扑展示模块
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Compatible Brands

Customization Options

Vendor Coding
Private Label
Custom Part Number
Packaging Design
Temperature Grade Selection
Absolute Maximum Ratings
Parameter Symbol Min. Max. Unit
Storage temperature TS -40  +85  °C
Supply voltage VCC -0.5  3.6  V
Note: Exceeding any one of these values may destroy the device permanently.

Recommended Operating Conditions
Parameter Symbol Min. Typical Max. Unit
Power supply voltage VCC 3.15 3.3 3.45 V
Power supply current ICC - - 430 mA
Surge current ISurge - - +30 mA
Operating case temperature Tc Standard 0 70 °C
Industrial -40 85 °C
Baud rate - 0.6 10.3125 11.3 Gbaud

Performance Specifications–Electrical
Parameter Symbol Min. Typ. Max Unit Notes
Transmitter
CML inputs(Differential) Vin 150 - 1200 mVpp AC coupled inputs
Input impedance(Differential) Zin 85 100 115 ohms Rin > 100 kohms @ DC
Tx_DISABLE input voltage – high - 2 - Vcc+0.3 V -
Tx_DISABLE input voltage – low - 0 - 0.8 V -
Tx_FAULT output voltage – high - 2 - Vcc+0.3 V Io = 400µA; host Vcc
Tx_FAULT output voltage – low - 0 - 0.5 V Io = -4.0Ma
Receiver
CML outputs(Differential) Vout 350 - 700 mVpp AC coupled outputs
Output impedance(Differential) Zout 85 100 115 ohms -
Rx_LOS output voltage – high - 2 - Vcc+0.3 V lo = 400µA; host Vcc
Rx_LOS output voltage – low - 0 - 0.8 V lo = -4.0Ma
MOD_DEF ( 2:0 ) VoH 2.5 - - V With serial ID
VoL 0 - 0.5 V

Optical Characteristics-1270nm DFB & PIN/TIA
Parameter Symbol Min. Typical Max. Unit
Power budget - 9 - - dB
Data rate - 0.6 10.3125 11.3 Gbps
Transmitter
Center wavelength λC 1260 1270 1280 nm
Spectral width (-20Db) ∆λ - - 1 nm
Side mode suppression ratio SMSR 30 - - dB
Average output power Pout, AVG -5 - 0 dBm
Extinction ratio ER 3.5 - - dB
Average power of OFF transmitter - - - -30 dBm
Relative intensity noise RIN - - -128 dB/Hz
TX disable assert time t_off - - 10 us
Receiver
Center wavelength λC 1320 - 1340 nm
Sensitivity PIN - - -14 dBm
Receiver overload PMAX 0.5 - - dBm
LOS de-assert LOSD - - -18 dBm
LOS assert LOSA -30 - - dBm

Optical Characteristics-1330nm DFB & PIN/TIA
Parameter Symbol Min. Typical Max. Unit
Power budget - 9 - - dB
Data rate - 0.6 10.3125 11.3 Gbps
Transmitter
Center wavelength λC 1320 1330 1340 nm
Spectral width (-20Db) ∆λ - - 1 nm
Side mode suppression ratio SMSR 30 - - dB
Average output power Pout, AVG -5 - 0 dBm
Extinction ratio ER 3.5 - - dB
Average power of OFF transmitter - - - -30 dBm
Relative intensity noise RIN - - -128 dB/Hz
TX disable assert time t_off - - 10 us
Receiver
Center wavelength λC 1260 - 1280 nm
Sensitivity PIN - - -14 dBm
Receiver overload PMAX 0.5 - - dBm
LOS de-assert LOSD - - -18 dBm
LOS assert LOSA -30 - - dBm

SFP+ TRANSCEIVER ELECTRICAL PAD LAYOUT

PIN FUNCTION DEFINITIONS
Pin Name Function Plug Seq. Notes
1 VeeT Transmitter Ground Note 5
2 TX Fault Transmitter Fault Indication Note 1
3 TX Disable Transmitter Disable Note 2, Module Disables on High or Open
4 SDA Module Definition 2 2-wire Serial Interface Data Line.
5 SCL Module Definition 1 2-wire Serial Interface Clock.
6 MOD-ABS Module Definition 0 Note 3
7 RS0 RX Rate Select (LVTTL). No Function Implement
8 LOS Loss of Signal Note 4
9 RS1 TX Rate Select (LVTTL). No Function Implement
10 VeeR Receiver Ground Note 5
11 VeeR Receiver Ground Note 5
12 RD- Inv. Received Data Out 3 Note 6
13 RD+ Received Data Out 3 Note 6
14 VeeR Receiver Ground Note 5
15 VccR Receiver Power 3.3V ± 5%, Note 7
16 VccT Transmitter Power 3.3V ± 5%, Note 7
17 VeeT Transmitter Ground Note 5
18 TD+ Transmit Data In Note 8
19 TD- Inv. Transmit Data In Note 8
20 VeeT Transmitter Ground Note 5
Notes:
1) TX Fault is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩ resistor on the host board. Pull up voltage between 2.0V and VccT/R+0.3V. When high, output indicates a laser fault of some kind. Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.

2) TX disable is an input that is used to shut down the transmitter optical output. It is pulled up within the module with a 4.7K – 10 KΩ resistor. Its states are:
Low (0 – 0.8V): Transmitter on
(>0.8, < 2.0V): Undefined
High (2.0 – 3.465V): Transmitter Disabled
Open: Transmitter Disabled

3) Module Absent, connected to VeeT or VeeR in the module.

4) LOS (Loss of Signal) is an open collector/drain output, which should be pulled up with a 4.7K – 10KΩ resistor. Pull up voltage between 2.0V and VccT/R+0.3V. When high, this output indicates the received optical power is below the worst-case receiver sensitivity (as defined by the standard in use). Low indicates normal operation. In the low state, the output will be pulled to < 0.8V.

5) The module signal ground contacts, VeeR and VeeT, should be isolated from the module case.

6) RD-/+: These are the differential receiver outputs. They are AC coupled 100Ω differential lines which should be terminated with 100Ω (differential) at the user SERDES. The AC coupling is done inside the module and is thus not required on the host board.

7) VccR and VccT are the receiver and transmitter power supplies. They are defined as 3.3V ±5% at the SFP+ connector pin. Maximum supply current is 300mA. Recommended host board power supply filtering is shown below. Inductors with DC resistance of less than 1 ohm should be used in order to maintain the required voltage at the SFP+ input pin with 3.3V supply voltage. When the recommended supply-filtering network is used, hot plugging of the SFP+ transceiver module will result in an inrush current of no more than 30mA greater than the steady state value. VccR and VccT may be internally connected within the SFP+ transceiver module.

8) TD-/+: These are the differential transmitter inputs. They are AC-coupled, differential lines with 100Ω differential termination inside the module. The AC coupling is done inside the module and is thus not required on the host board.

Performance Testing

Each module is tested before shipment to help ensure stable optical and electrical performance.

Compatibility Verification

Compatibility validation is available for major switch and router platforms.

Reliability Screening

Selected products support aging, temperature cycle, and stability testing for demanding applications.

Traceable Quality Control

Inspection and production records support more consistent quality control and batch traceability.

光模块产品详情订购信息---SFP+