40G CWDM4 QSFP+ ER4 Transceiver for 40km SMF Links, Duplex LC
QSFP+40-CW4-40(ER4)-LCD
- Broad Multi-Brand Compatibility
- Flexible Customization Support
- Tested for Reliable Performance
- Fast Response & Delivery
- Professional Technical Support
The FC-LINK QSFP+ 40G CWDM4 40km ER4 LC DX transceiver module is designed for 40GbE connections over single mode fiber (SMF) with a range of up to 40km. It adheres to IEEE 802.3ba 40GBASE-ER4 standards and provides digital diagnostics via an I2C interface as outlined by the QSFP+ MSA.
| SPECIFICATIONS | |||
|---|---|---|---|
| Product Model | QSFP+40-CW4-40(ER4)-LCD | Manufacturer Brand | FC-LINK |
| Package Type | QSFP+ | Optical Connector | LC Duplex |
| Max Data Rate | 40Gbps | Channel Data Rate | 10.3125Gbps |
| Effective Transmission Distance | 40km | ||
| Wavelength | 1271nm 1291nm 1311nm 1331nm | Operating Voltage | 3.3V |
| Fiber Type | SMF | Core Size | 9/125µm |
| Transmitter Type | DFB CWDM | Receiver Type | APD |
| TX Power | -2.7~4.5dBm | Receiver Sensitivity | <-21.2dBm |
| Digital Diagnostic Monitoring(DDM) | YES | Receiver Overload | -4.5dBm |
| Power Consumption | ≤3.5W (Commercial) ≤4.5W (Industrial) | Protocols | IEEE 802.3ba 40GBASE-ER4 |
| Operating Temperature(Commercial) | 0℃~+70℃ | Storage Temperature(Commercial) | -40℃~+85℃ |
| Operating Temperature(Industrial) | -40℃~+85℃ | Storage Temperature(Industrial) | -40℃~+85℃ |
Server-to-Switch Data Center Links
Used for 10G/25G/100G optical uplinks between servers and top-of-rack switches in high-density data center deployments.
Building-to-Building Campus Backbone
Suitable for 1G/10G fiber links between office buildings, campus distribution rooms, and backbone aggregation points.
Access-to-Core Enterprise Uplinks
Designed for switch uplinks from access to aggregation or core layers in enterprise and campus network architectures.
Industrial Switching in Harsh Environments
Applied in industrial Ethernet, automation systems, and outdoor cabinets where wider temperature tolerance and stable fiber communication are required.
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Compatible Brands
Customization Options
Vendor Coding
Private Label
Custom Part Number
Packaging Design
Temperature Grade Selection
| Absolute Maximum Ratings | |||||||||
| Parameter | Symbol | Min. | Max. | Unit | |||||
| Storage temperature | TS | -40 | +85 | °C | |||||
| Supply voltage | VCC | -0.5 | 3.6 | V | |||||
| Operating relative humidity | RH | 0 | 85 | % | |||||
| *Exceeding any one of these values may destroy the device immediately. | |||||||||
| Recommended Operating Conditions | |||||||||
| Parameter | Symbol | Min. | Typical | Max. | Unit | ||||
| Operating case temperature | Tc | QSFP+40-CW4-40(ER4)-LCD | 0 | - | +70 | °C | |||
| -40 | - | +85 | °C | ||||||
| Power supply voltage | Vcc | 3.135 | 3.3 | 3.465 | V | ||||
| Commercial power dissipation | PD | - | - | 3.5 | W | ||||
| Industrial power dissipation | PD | - | - | 4.5 | W | ||||
| Link distance with G.652 | D | - | - | 40 | km | ||||
| Performance Specifications-Electrical | |||||||||
| Parameter | Symbol | Min. | Typ. | Max | Unit | Notes | |||
| Supply voltage | - | 3.1 | - | 3.47 | V | - | |||
| Supply current | Icc | - | - | 1.44 | A | - | |||
| Transmit turn-on time | - | - | - | 2000 | ms | Note3 | |||
| Transmitter | |||||||||
| Differential input voltage swing | Vin,pp | 190 | - | 700 | mVp-p | - | |||
| Input impedance (Differential) | Zin | 90 | 100 | 110 | ohms | Rin > 100 kohms @ DC |
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| Receiver | |||||||||
| Differential output voltage swing | Vout,pp | 300 | - | 850 | mVp-p | - | |||
| AC common mode output voltage | - | - | - | 7.5 | mV | RMS | |||
| Output impedance (Differential) | Zout | 90 | 100 | 110 | ohms | - | |||
| Output transition time | - | 28 | - | - | ps | 20%~80% | |||
| Optical Characteristics | |||||||||
| Parameter | Symbol | Min. | Typical | Max. | Unit | ||||
| Transmitter | |||||||||
| Signaling speed per lane | BRAVE | - | 10.3125 | 11.2 | Gbps | ||||
| Side mode launch power | SMSR | 30 | - | - | dB | ||||
| Total average launch power | PT | - | - | 10.5 | dBm | ||||
| Lane_0 center wavelength | λC0 | 1264.5 | 1271 | 1277.5 | nm | ||||
| Lane_1 center wavelength | λC1 | 1284.5 | 1291 | 1297.5 | nm | ||||
| Lane_2 center wavelength | λC2 | 1304.5 | 1311 | 1317.5 | nm | ||||
| Lane_3 center wavelength | λC3 | 1324.5 | 1331 | 1337.5 | nm | ||||
| Average launch power per lane | Peach | -2.7 | - | 4.5 | dBm | ||||
| Average launch power of OFF transmitter per lane | - | - | - | -30 | dBm | ||||
| Relative intensity noise | Rin | - | - | -128 | dB/Hz | ||||
| Optical modulation amplitude | Poma | 0.3 | 0 | 5.0 | dBm | ||||
| Optical return loss tolerance | - | - | - | 20 | dB | ||||
| Differnce in launch power between any two lanes | Ptx,diff | - | - | 4.7 | dB | ||||
| Transmitter reflectance | RT | - | - | -12 | dB | ||||
| Extinction ratio | ER | 5.5 | - | - | dB | ||||
| Transmitter eye mask definition{X1, X2, X3, Y1, Y2, Y3} | - | {0.25 ，0.4 ，0.45 ，0.25 ，0.28 ，0.4} | - | ||||||
| Receiver | |||||||||
| Signaling speed per lane | BRAVE | - | 10.3125 | - | Gbps | ||||
| Data rate variation | - | -100 | - | +100 | ppm | ||||
| Damage threshold | Rdam | 3.8 | - | - | dBm | ||||
| Lane_0 center wavelength | λC0 | 1264.5 | 1271 | 1277.5 | nm | ||||
| Lane_1 center wavelength | λC1 | 1284.5 | 1291 | 1297.5 | nm | ||||
| Lane_2 center wavelength | λC2 | 1304.5 | 1311 | 1317.5 | nm | ||||
| Lane_3 center wavelength | λC3 | 1324.5 | 1331 | 1337.5 | nm | ||||
| Average receive power per lane | Rpow | -21.2 | - | -4.5 | dBm | ||||
| Receiver sensitivity in OMA per lane | Pmin | - | - | -19 | dBm | ||||
| Stressed receiver sensitivity (OMA) per lane | RXSRS | - | - | -16.8 | dBm | ||||
| Conditions of stressed receiver sensitivity test： | |||||||||
| Vertical eye closure penalty | VECP | - | 2.2 | - | dB | ||||
| Stressed J2 jitter | J2 | - | 0.3 | - | UI | ||||
| Stressed J9 jitter | J9 | - | 0.47 | - | UI | ||||
| LOS assert | LOSA | -35 | - | - | dBm | ||||
| LOS de-assert | LOSD | - | - | -23 | dBm | ||||
| LOS hysteresis | - | 0.5 | - | - | dB | ||||
| QSFP+ Transceiver Electrical Pad Layout |
| Pin Arrangement and Definition | |||||||||
| Pin | Logic | Symbol | Description | Plug Sequence | Notes | ||||
| 1 | - | GND | Ground | 1 | 1 | ||||
| 2 | CML-I | Tx2n | Transmitter Inverted Data Input | 3 | - | ||||
| 3 | CML-I | Tx2p | Transmitter Non-Inverted Data Input | 3 | - | ||||
| 4 | - | GND | Ground | 1 | 1 | ||||
| 5 | CML-I | Tx4n | Transmitter Inverted Data Input | 3 | - | ||||
| 6 | CML-I | Tx4p | Transmitter Non-Inverted Data Input | 3 | - | ||||
| 7 | - | GND | Ground | 1 | 1 | ||||
| 8 | LVTTL-I | ModSelL | Module Select | 3 | - | ||||
| 9 | LVTTL-I | ResetL | Module Reset | 3 | - | ||||
| 10 | - | VccRx | +3.3V Power Supply Receiver | 2 | 2 | ||||
| 11 | LVCMOS- I/O | SCL | 2-wire Serial Interface Clock | 3 | - | ||||
| 12 | LVCMOS- I/O | SDA | 2-wire Serial Interface Data | 3 | - | ||||
| 13 | - | GND | Ground | 1 | 1 | ||||
| 14 | CML-O | Rx3p | Receiver Non-Inverted Data Output | 3 | - | ||||
| 15 | CML-O | Rx3n | Receiver Inverted Data Output | 3 | - | ||||
| 16 | - | GND | Ground | 1 | 1 | ||||
| 17 | CML-O | Rx1p | Receiver Non-Inverted Data Output | 3 | - | ||||
| 18 | CML-O | Rx1n | Receiver Inverted Data Output | 3 | - | ||||
| 19 | - | GND | Ground | 1 | 1 | ||||
| 20 | - | GND | Ground | 1 | 1 | ||||
| 21 | CML-O | Rx2n | Receiver Inverted Data Output | 3 | - | ||||
| 22 | CML-O | Rx2p | Receiver Non-Inverted Data Output | 3 | - | ||||
| 23 | - | GND | Ground | 1 | 1 | ||||
| 24 | CML-O | Rx4n | Receiver Inverted Data Output | 3 | - | ||||
| 25 | CML-O | Rx4p | Receiver Non-Inverted Data Output | 3 | - | ||||
| 26 | - | GND | Ground | 1 | 1 | ||||
| 27 | LVTTL-O | ModPrsL | Module Present | 3 | - | ||||
| 28 | LVTTL-O | IntL | Interrupt | 3 | - | ||||
| 29 | - | VccTx | +3.3V Power supply transmitter | 2 | 2 | ||||
| 30 | - | Vcc1 | +3.3V Power supply | 2 | 2 | ||||
| 31 | LVTTL-I | LPMode | Low Power Mode | 3 | - | ||||
| 32 | - | GND | Ground | 1 | 1 | ||||
| 33 | CML-I | Tx3p | Transmitter Non-Inverted Data Input | 3 | - | ||||
| 34 | CML-I | Tx3n | Transmitter Inverted Data Input | 3 | - | ||||
| 35 | - | GND | Ground | 1 | 1 | ||||
| 36 | CML-I | Tx1p | Transmitter Non-Inverted Data Input | 3 | - | ||||
| 37 | CML-I | Tx1n | Transmitter Inverted Data Input | 3 | - | ||||
| 38 | - | GND | Ground | 1 | 1 | ||||
| 1: GND is the symbol for signal and supply (power) common for the QSFP+ module. All are common within the QSFP+ module and all module voltages are referenced to this potential unless otherwise noted. Connect these directly to the host board signal-common ground plane. | |||||||||
| 2: Vcc Rx, Vcc1 and Vcc Tx are the receiver and transmitter power supplies and shall be applied concurrently. Requirements defined for the host side of the Host Edge Card Connector are listed in Table 6. Recommended host board power supply filtering is shown in Figures 3 and 4. Vcc Rx Vcc1 and Vcc Tx may be internally connected within the QSFP+ Module in any combination. The connector pins are each rated for a maximum current of 500mA. | |||||||||
Performance Testing
Each module is tested before shipment to help ensure stable optical and electrical performance.
Compatibility Verification
Compatibility validation is available for major switch and router platforms.
Reliability Screening
Selected products support aging, temperature cycle, and stability testing for demanding applications.
Traceable Quality Control
Inspection and production records support more consistent quality control and batch traceability.
